Introduction
AHL-HP50 Laser slicer
scribing and cutting metal materials, germanium, gallium arsenide and other sem ico nductor substrate material and processing solar cell board, silico n chips, potsherd and aluminum foil.
Functions and advantages the laser power can be continuously regulated
high precision and high speed
friendly man-machine contact surface which can show the cutting trace timing and the operated simply
non-touch processing resulted by very low rate of invalid chips
environmental protection and energy conservation Application scope
Sample
CNC-1440
- Product Code:
- Availability: In Stock